Shear creep behavior of Sn-3Ag-0.5Cu solder bumps in ball grid array

Author

An, Bing ; Gu, Guoqiang ; Zhang, Wenfei ; Wu, Yiping

Author_Institution

Wuhan Nat. Lab. of Optoelectron., Wuhan, China

fYear

2011

fDate

25-28 Oct. 2011

Firstpage

257

Lastpage

261

Abstract

A precise creep tester was established to in situ measure the micro strain of the solder under different temperatures and certain loads. The ball grid array samples with the diameter of 0.76 mm Sn-3Ag-0.5Cu (SAC305) solder bumps were tested under the shear strength ranged from 7 MPa up to 14 MPa and the heating temperatures from 24°C up to 100°C. Creep constitutive equation of the steady-state creep, together with its stress exponent n, creep activation energy Q and structure constant A were determined by employing the power law creep. The coarsening Ag₃Sn particles were observed with the temperature rising up under a certain load.

Keywords

ball grid arrays; copper alloys; creep testing; shear strength; silver alloys; solders; strain measurement; tin alloys; Sn-Ag-Cu; ball grid array; creep activation energy; creep constitutive equation; creep tester; microstrain measurement; power law creep; pressure 7 MPa to 14 MPa; shear creep behavior; shear strength; size 0.76 mm; solder bumps; steady-state creep; structure constant; temperature 24 degC to 100 degC; Creep; Lead; Steady-state; Strain; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials (APM), 2011 International Symposium on

Conference_Location

Xiamen

ISSN

1550-5723

Print_ISBN

978-1-4673-0148-0

Type

conf

DOI

10.1109/ISAPM.2011.6105711

Filename

6105711