Title :
Shear creep behavior of Sn-3Ag-0.5Cu solder bumps in ball grid array
Author :
An, Bing ; Gu, Guoqiang ; Zhang, Wenfei ; Wu, Yiping
Author_Institution :
Wuhan Nat. Lab. of Optoelectron., Wuhan, China
Abstract :
A precise creep tester was established to in situ measure the micro strain of the solder under different temperatures and certain loads. The ball grid array samples with the diameter of 0.76 mm Sn-3Ag-0.5Cu (SAC305) solder bumps were tested under the shear strength ranged from 7 MPa up to 14 MPa and the heating temperatures from 24°C up to 100°C. Creep constitutive equation of the steady-state creep, together with its stress exponent n, creep activation energy Q and structure constant A were determined by employing the power law creep. The coarsening Ag3Sn particles were observed with the temperature rising up under a certain load.
Keywords :
ball grid arrays; copper alloys; creep testing; shear strength; silver alloys; solders; strain measurement; tin alloys; Sn-Ag-Cu; ball grid array; creep activation energy; creep constitutive equation; creep tester; microstrain measurement; power law creep; pressure 7 MPa to 14 MPa; shear creep behavior; shear strength; size 0.76 mm; solder bumps; steady-state creep; structure constant; temperature 24 degC to 100 degC; Creep; Lead; Steady-state; Strain; Stress;
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4673-0148-0
DOI :
10.1109/ISAPM.2011.6105711
