Title :
Failure process of solder joint under mechanical vibration based on a real-time data acquisition method
Author :
Zhang, Hongwu ; Sun, Fenglian ; Liu, Yang ; Zhou, Zhen ; Qin, Yong
Author_Institution :
Sch. of Mater. Sci. & Eng., Harbin Univ. Sci. & Technol., Harbin, China
Abstract :
Dynamic voltage signal across solder joints during mechanical vibration test was monitored and collected real-timely with a self-designed data acquisition system. Failure process of solder joint was studied by processing and analyzing data. In the paper, lifetime of solder joint was also compared by changing solder joint location, solder joint composition and vibration acceleration. Results indicated that voltage across solder joints kept at about 0.14v from 0s to 40s, which indicated that crack of solder joint did not form. Voltage of solder joint suddenly rose to 0.45v between 44.2s and 45.2s, which illustrated crack initiation and growth rapidly. In addition, lifetime of solder joint on the edge of test board was about 4.5 times longer than that of solder joint in the center of test board. It was found that with vibration acceleration from 20g to 25g increase of 25%, lifetime of solder joint decreased from 980s to 105s with 89%.
Keywords :
data acquisition; failure analysis; solders; vibrations; crack initiation; dynamic voltage signal; failure process; mechanical vibration test; real-time data acquisition method; solder joint composition; solder joint location; time 0 s to 40 s; vibration acceleration; Acceleration; Data acquisition; Electronic components; Materials; Reliability; Soldering; Vibrations;
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4673-0148-0
DOI :
10.1109/ISAPM.2011.6105715
