The packaging of large spot-size optoelectronic devices

Author

Collins, J.V. ; Lealman, I.F. ; Fiddyment, P.J. ; Thurlow, A.R. ; Ford, C.W. ; Rogers, D.C. ; Jones, C.A.

Author_Institution

British Telecom Res. Labs., Ipswich, UK

fYear

1996

fDate

28-31 May 1996

Firstpage

640

Lastpage

644

Abstract

Lasers have been passively aligned to cleaved singlemode optical fibres on a silicon bench with coupling efficiencies of over 50%. This is the highest known reported result. Using the relaxed tolerances obtained from large spotsize lasers a very simple high performance laser package has also be produced. The combination of semiconductor device developments, silicon micromachining and novel packaging techniques has realised complicated optoelectronic modules which will give the technical performance and economic requirements needed for future optical telecommunication networks

Keywords

optical fibre couplers; packaging; semiconductor lasers; 50 percent; Si; cleaved singlemode optical fibre; coupling efficiency; laser package; micromachining; optoelectronic device; passive alignment; relaxed tolerance; semiconductor device; silicon bench; spot size; Fiber lasers; Micromachining; Optical coupling; Optical devices; Optical fibers; Optoelectronic devices; Semiconductor device packaging; Semiconductor devices; Semiconductor lasers; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517453

Filename

517453