High performance, low-cost leadframe with a heat spreader for HQFPs

Author

Ohtaka, Tastuya ; Kameyama, Yasuharu ; Yamagishi, Isao ; Yonemoto, Takaharu ; Suzumura, Takashi

Author_Institution

Syst. Mater. Lab., Hitachi Cable Ltd., Ibaraki, Japan

fYear

1996

fDate

28-31 May 1996

Firstpage

682

Lastpage

686

Abstract

Leadframes with heat spreaders have been developed for mounting high power LSI devices, such as MPUs and MPEGs. Power dissipation of this package is from 2 to 3 W. However, there is a great need for less expensive leadframes for Heatspreader-enhanced Quad Flat Packs (HQFPs) for general use. Therefore, we modified the structure of the leadframe for the HQFP and improved the manufacturing to achieve very low-cost leadframes. The features of this new leadframe are as follows: (1) Nearly the same cost as a conventional leadframe with-out a heat spreader. (2) From 2 to 3 W thermal dissipation. (3) Easy wire bonding. (4) High reliability through solder reflow. This leadframe achieves high thermal performance and guarantees high reliability at the least cost

Keywords

integrated circuit packaging; integrated circuit reliability; large scale integration; lead bonding; reflow soldering; thermal analysis; 2 to 3 W; HQFP; heat spreader; heatspreader-enhanced QFP; high power LSI devices; high reliability; high thermal performance; low-cost leadframe; quad flat packs; solder reflow; thermal dissipation; wire bonding; Copper; Costs; Electronic packaging thermal management; Electronics packaging; Insulation; Large scale integration; Polyimides; Power dissipation; Temperature; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517458

Filename

517458