Title :
Reliability assessment of BGA packages
Author :
Tan, Geok-Leong ; Hoo, Chuan-Yau ; Chew, Gerard ; Low, Jim-Hee ; Tay, Nam-Beng ; Chakravorty, K.K. ; Lim, Thiam-Beng
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
As interest in BGA packaging continues to surge in the industry, many companies are evaluating the package for immediate and future use. Evaluation and acceptance of new packages take time. Furthermore, standards are required to benchmark new packages. This paper presents the results of a reliability assessment exercise on five types of BGA packages. This assessment includes JEDEC moisture sensitivity, temperature cycling, thermal shock, mechanical test, warpage measurement and FEA simulation. Four types of overmolded BGA (different substrates, e.g. 2-layer, 4-layer, metal core) and one glob-top BGA packages were tested
Keywords :
deformation; environmental degradation; environmental testing; finite element analysis; integrated circuit packaging; integrated circuit reliability; mechanical testing; moisture; plastic packaging; BGA packages; FEA simulation; JEDEC moisture sensitivity; glob-top packages; mechanical test; overmolded packages; reliability assessment; substrates; temperature cycling; thermal shock; warpage measurement; Acoustic testing; Delamination; Electronics packaging; Microelectronics; Moisture; Plastic integrated circuit packaging; Plastic packaging; Surges; Temperature sensors; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.517459
