• DocumentCode
    2683341
  • Title

    Impact of inductance and routing orientation on timing performances of coupled interconnect lines

  • Author

    Deschacht, D.

  • Author_Institution
    Lab. d´´Inf., de Robot. et de Microelectron. de Montpellier LIRMM, Univ. Montpellier II, Montpellier, France
  • fYear
    2010
  • fDate
    23-25 March 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    As the interconnect lines play an increasingly dominant role in determining circuit performance, the dynamic delay variation due to the switching activity of neighboring lines has to be accurately characterized. The goal of this work is to simulate the effect of inductance and routing orientation and then to investigate their effects on timing performances by considering three configurations of three parallel coupled interconnects. For a Deep-Sub-Micron process, we show that when analyzing VLSI circuits, if standard distributed RC models are used, and inductive effects and routing orientation are ignored, large errors can occur in the prediction and evaluation of the circuit behaviour. Both affect greatly circuit performances.
  • Keywords
    RC circuits; VLSI; integrated circuit interconnections; network routing; timing circuits; VLSI circuits; circuit behaviour; circuit performance; coupled interconnect lines; deep-sub-micron process; distributed RC models; dynamic delay variation; inductance; inductive effects; parallel coupled interconnects; routing orientation; switching activity; timing performances; Circuit analysis; Circuit optimization; Circuit simulation; Coupling circuits; Delay; Inductance; Integrated circuit interconnections; Routing; Switching circuits; Timing; VLSI interconnect; crosstalk; routing orientation; signal integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology of Integrated Systems in Nanoscale Era (DTIS), 2010 5th International Conference on
  • Conference_Location
    Hammamet
  • Print_ISBN
    978-1-4244-6338-1
  • Type

    conf

  • DOI
    10.1109/DTIS.2010.5487575
  • Filename
    5487575