DocumentCode
2683341
Title
Impact of inductance and routing orientation on timing performances of coupled interconnect lines
Author
Deschacht, D.
Author_Institution
Lab. d´´Inf., de Robot. et de Microelectron. de Montpellier LIRMM, Univ. Montpellier II, Montpellier, France
fYear
2010
fDate
23-25 March 2010
Firstpage
1
Lastpage
5
Abstract
As the interconnect lines play an increasingly dominant role in determining circuit performance, the dynamic delay variation due to the switching activity of neighboring lines has to be accurately characterized. The goal of this work is to simulate the effect of inductance and routing orientation and then to investigate their effects on timing performances by considering three configurations of three parallel coupled interconnects. For a Deep-Sub-Micron process, we show that when analyzing VLSI circuits, if standard distributed RC models are used, and inductive effects and routing orientation are ignored, large errors can occur in the prediction and evaluation of the circuit behaviour. Both affect greatly circuit performances.
Keywords
RC circuits; VLSI; integrated circuit interconnections; network routing; timing circuits; VLSI circuits; circuit behaviour; circuit performance; coupled interconnect lines; deep-sub-micron process; distributed RC models; dynamic delay variation; inductance; inductive effects; parallel coupled interconnects; routing orientation; switching activity; timing performances; Circuit analysis; Circuit optimization; Circuit simulation; Coupling circuits; Delay; Inductance; Integrated circuit interconnections; Routing; Switching circuits; Timing; VLSI interconnect; crosstalk; routing orientation; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology of Integrated Systems in Nanoscale Era (DTIS), 2010 5th International Conference on
Conference_Location
Hammamet
Print_ISBN
978-1-4244-6338-1
Type
conf
DOI
10.1109/DTIS.2010.5487575
Filename
5487575
Link To Document