The effect of palladium addition to the 63Sn37Pb solder on the process of the CCGA package

Author

Huang, Yingzhuo ; Lin, Pengrong ; Cao, Yusheng ; Yao, Quanbin

Author_Institution

Beijing MXTronics Corp. Beijing, Beijing, China

fYear

2011

fDate

25-28 Oct. 2011

Firstpage

145

Lastpage

148

Abstract

Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of balls which create a greater standoff, providing a flexible interconnection with improved thermal fatigue life of the package solder joint. This paper introduced a technology featured a palladium addition to the 63Sn37Pb solder on the column-to-component pads which formed palladium-tin intermetallics that did not melt during initial the printed circuit board (PCB) assembly and added additional strength to the solder joint.

Keywords

ball grid arrays; ceramic packaging; lead alloys; reliability; solders; tin alloys; CBGA; CCGA package; PCB assembly; SnPb; board-level reliability; ceramic ball grid array packages; ceramic column grid array packages; column-to-component pads; high-density interconnections; high-temperature solder columns; package solder joint; palladium addition; palladium-tin intermetallics; printed circuit board assembly; thermal fatigue life; Arrays; Intermetallic; Joints; Packaging; Palladium; Reliability; Surface morphology;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials (APM), 2011 International Symposium on

Conference_Location

Xiamen

ISSN

1550-5723

Print_ISBN

978-1-4673-0148-0

Type

conf

DOI

10.1109/ISAPM.2011.6105728

Filename

6105728