Title :
Enhanced PBGA-the next generation
Author :
Carichner, Karla ; Dandia, Sanjay
Author_Institution :
LSI Logic Corp., Fremont, CA, USA
Abstract :
This paper describes LSI Logic´s new generation of Enhanced Plastic Ball Grid Array (EPBGA) package designs. The first generation was developed and implemented into production. As its popularity grew, new performance requirements emerged. The second generation was designed with enhancements to meet these new requirements. This paper describes the first generation to give the reader sufficient background information, and proceeds to discuss the enhancements of the second generation, including their implementation, and their effect on the manufacturability and reliability of the package family
Keywords :
integrated circuit packaging; integrated circuit reliability; microassembling; plastic packaging; LSI Logic; ball grid array package; enhanced PBGA; enhanced plastic BGA package; manufacturability; reliability; Bonding; Copper; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Large scale integration; Logic arrays; Logic design; Variable structure systems;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.517461
