Static thermal resistance test and simulation analysis technology for hybrid microcircuit

The miniaturization of packaging volume for hybrid microcircuit and the increasing of dissipated power for chip make its junction case thermal resistance parameters become the focus of people´s study and attention. The thermal resistance sample was designed based on a new embedded copper enhance case and static measurement was used, transient temperature response curve of internal die was showed by testing, thermal resistance - heat capacity network model was obtained through numerical deconvolution, the thermal resistance of internal structures were analyzed, which was compared with the theory calculation result of 45° method, and the effect of each layer structure on overall junction case thermal resistance was analyzed. In addition, heat dissipation performance was studied by comparative analysis between new case and original cold rolled steel case. Finally, temperature distribution and junction case thermal resistance of new hybrid circuit module were studied by finite element simulation. The results showed that the thermal resistance value of new embedded copper packaging case decreased about 50% in contrast to cold rolled steel case. Decreasing overall internal resistance of microcircuit need improves the heat dissipation performance of case, meanwhile, the effect of each layer structure on whole internal thermal resistance should be decreased as much as possible.