DocumentCode :
2683706
Title :
Experimental studies of non-Fickian moisture diffusion in plastic packages
Author :
Yang, Shaohua ; Liu, Hailong
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China
fYear :
2011
fDate :
25-28 Oct. 2011
Firstpage :
336
Lastpage :
341
Abstract :
Moisture penetrating into the polymer and subsequent hygroswelling stress play an important role in the integrity and reliability of plastic electronic packages. In this paper, moisture absorption experiments of four types of plastic encapsulated microcircuits (PEMs) were conducted. Moisture diffusion characteristics of PEMs available by experiments were measured and typical moisture diffusion characteristics were calculated. Fickian second law controls distribution of moisture concentration in plastic packages, and it was found that moisture transport deviations from ideal Fickian behavior under the higher temperature and humidity stresses, which is the so-called non-Fickan diffusion. It was attributed to the “two-stage” sorption. Analysis of moisture diffusion coefficients shows that different packages have values varying largely. Besides, comparing the saturated moisture and vapor concentration, it can be found that the moisture exists with combining state of liquid and vapor in plastic electronic packages, which probably a main cause of non-Fickian moisture diffusion. So the experimental results indicated that it´s necessary to measure the moisture diffusion coefficient in plastic electronic packages in order to reduce potential risk during their assembly process and long-term applications.
Keywords :
electronics packaging; integrated circuits; plastic packaging; polymers; reliability; PEM; hygroswelling stress; moisture absorption; non-Fickian moisture diffusion; plastic electronic packages; plastic encapsulated microcircuits; plastic packages; polymer; reliability; Absorption; Compounds; Moisture; Moisture measurement; Plastics; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
ISSN :
1550-5723
Print_ISBN :
978-1-4673-0148-0
Type :
conf
DOI :
10.1109/ISAPM.2011.6105741
Filename :
6105741
Link To Document :
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