• DocumentCode
    2683706
  • Title

    Experimental studies of non-Fickian moisture diffusion in plastic packages

  • Author

    Yang, Shaohua ; Liu, Hailong

  • Author_Institution
    Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    336
  • Lastpage
    341
  • Abstract
    Moisture penetrating into the polymer and subsequent hygroswelling stress play an important role in the integrity and reliability of plastic electronic packages. In this paper, moisture absorption experiments of four types of plastic encapsulated microcircuits (PEMs) were conducted. Moisture diffusion characteristics of PEMs available by experiments were measured and typical moisture diffusion characteristics were calculated. Fickian second law controls distribution of moisture concentration in plastic packages, and it was found that moisture transport deviations from ideal Fickian behavior under the higher temperature and humidity stresses, which is the so-called non-Fickan diffusion. It was attributed to the “two-stage” sorption. Analysis of moisture diffusion coefficients shows that different packages have values varying largely. Besides, comparing the saturated moisture and vapor concentration, it can be found that the moisture exists with combining state of liquid and vapor in plastic electronic packages, which probably a main cause of non-Fickian moisture diffusion. So the experimental results indicated that it´s necessary to measure the moisture diffusion coefficient in plastic electronic packages in order to reduce potential risk during their assembly process and long-term applications.
  • Keywords
    electronics packaging; integrated circuits; plastic packaging; polymers; reliability; PEM; hygroswelling stress; moisture absorption; non-Fickian moisture diffusion; plastic electronic packages; plastic encapsulated microcircuits; plastic packages; polymer; reliability; Absorption; Compounds; Moisture; Moisture measurement; Plastics; Polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials (APM), 2011 International Symposium on
  • Conference_Location
    Xiamen
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4673-0148-0
  • Type

    conf

  • DOI
    10.1109/ISAPM.2011.6105741
  • Filename
    6105741