• DocumentCode
    2683744
  • Title

    Weld technology reliability analysis of cathode in vacuum tube

  • Author

    Song, Fang Fang ; Feng, Xian-long ; Li, Sha Jin ; Yu, Shiji

  • Author_Institution
    Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    414
  • Lastpage
    417
  • Abstract
    Influence of weld technology on reliability and life to cathode in vacuum tube was studied by requests of microwave tube. The quality of weld technology quite affects the emission capability of cathode. The mode of weld quite affects thermal efficiency of cathode in vacuum tube. Thermal efficiency of cathode can increase availably by changing the weld technology on the heat transfer path. Thermal analysis and optimization design of cathode module for vacuum tube was carried out with the FEM in order to obtain required cathode temperature with lower heat power. The weld mode quite affects the cathode heat power, for example, the cathode heat power can reduce 28.6% with 8+8 laser spot welding. We have also built the life test system of TWT´s electron gun structure of 8+8 laser spot welding, using this life test system, up to 30 years life of cathode is forecasted.
  • Keywords
    cathodes; electron guns; finite element analysis; heat transfer; laser beam welding; life testing; microwave tubes; reliability; spot welding; thermal analysis; travelling wave tubes; vacuum tubes; welds; FEM; TWT electron gun structure; cathode heat power; cathode module; cathode temperature; emission capability; heat transfer path; laser spot welding; life test system; microwave tube; optimization design; thermal analysis; thermal efficiency; vacuum tube; weld mode; weld technology reliability analysis; Cathodes; Electron tubes; Reliability; Resistance heating; Thermal analysis; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials (APM), 2011 International Symposium on
  • Conference_Location
    Xiamen
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4673-0148-0
  • Type

    conf

  • DOI
    10.1109/ISAPM.2011.6105743
  • Filename
    6105743