Effect of substrate material on thermal reliability of high-power electronic packaging device

Thermal performance and reliability are necessary to be considered for high-power electronic packaging device design. In this paper, the thermal characteristic of one kind of packaging device was studied using FEM and experimentation, for phase shifter. The model for thermal condition of phase shifter was established. The top junction temperature obtained by simution shows tendency as tested experiment results, verifying the correctness of the simulation model and method used. The relation of relative temperature rising to different substrate thickness and material is studied by simution. The quantitative relations of these parameters and temperature provided a theoretical basis for the thermal design and reliability estimate, the optimization of parameters and the reliability improvement of phase shifter.