DocumentCode
2684056
Title
[Front cover]
fYear
2011
fDate
25-28 Oct. 2011
Abstract
The following topics are dealt with: nano-functional materials, nano devices and emerging materials; advanced packages and interconnections; and underfill, adhesives and high density substrates/board.
Keywords
adhesives; electronics packaging; nanotechnology; substrates; adhesives; advanced package; advanced packaging materials; emerging materials; high density substrates/board; interconnections; nanodevices; nanofunctional materials; underfill;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location
Xiamen
ISSN
1550-5723
Print_ISBN
978-1-4673-0148-0
Type
conf
DOI
10.1109/ISAPM.2011.6105758
Filename
6105758
Link To Document