Embedded Passives On Multi-Layer Printed Circuit Board for 5GHz WLAN Power Amplifier

Author

Wei, Chang-Lin ; Liu, Hung-Yen ; Chen, Chang-Sheng ; Tsai, Cheng-Hua ; Shyu, Chin-Sun ; Lay, Sinn-Juh ; Lee, Min-Lin

Author_Institution

Ind. Technol. Res. Inst., Hsinchu

fYear

2007

fDate

25-29 May 2007

Firstpage

1

Lastpage

5

Abstract

This paper introduces the design and model for the basic embedded passives, and methods of circuits design with embedded elements for IEEE 802.11a on PWB lamination process. The power amplifier exhibits 26.4 dB of gain, 26 dBm of output PldB, and output IP3 of 37.2 dBm. Six layer stacks and three kinds of materials, such as Hi-DK material, low-loss material and commercial organic material were applied in this design. In this substrate, we use special high dielectric constant (DK>60 @ 1MHz) material to design embedded capacitors and use the new embedded resistors (Ik ohm/per square) for whole SiP module. The simulation and measured results have demonstrated a successful circuit design for 802.11a WLAN.

Keywords

MMIC power amplifiers; high-k dielectric thin films; printed circuits; resistors; system-in-package; wireless LAN; Hi-DK material; IEEE 802.11a; PWB lamination process; WLAN power amplifier; circuits design; commercial organic material; embedded capacitors; embedded elements; embedded passives; embedded resistors; frequency 5 GHz; gain 26.4 dB; high dielectric constant; multilayer printed circuit board; Circuit synthesis; Dielectric materials; Dielectric substrates; Gain; High-K gate dielectrics; Lamination; Organic materials; Power amplifiers; Printed circuits; Wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

Portable Information Devices, 2007. PORTABLE07. IEEE International Conference on

Conference_Location

Orlando, FL

Print_ISBN

1-4244-1039-8

Type

conf

DOI

10.1109/PORTABLE.2007.71

Filename

4216966