An on-board differential patch array antenna and interconnects design for 60 GHz applications

Author

Wang, Ruoyu ; Yaoming Sun ; Wipf, Christian ; Scheytt, Johann Christoph

Author_Institution

IHP, Frankfurt (Oder), Germany

fYear

2011

fDate

7-9 Nov. 2011

Firstpage

1

Lastpage

5

Abstract

An on-board differential patch array antenna for 60 GHz applications was designed, fabricated and measured. The antenna was optimized including bond-wires which are used for packaging. A gain of 9.4-12.4 dBi was achieved in a broad frequency range of 57-66 GHz. A double bonding L-C-L structure was applied in order to improve the impedance matching between the antenna and the RFIC. A coplanar waveguide (CPW) to microstrip transmission line (MTL) transition was designed to measure the antenna and interconnects on board. This transition has no vias so that the fabrication process is simplified, but the performance is not deteriorated.

Keywords

MIMIC; coplanar waveguides; impedance matching; integrated circuit interconnections; microstrip antenna arrays; microstrip transitions; millimetre wave antenna arrays; CPW; MTL transition; RFIC; bond-wires; coplanar waveguide; double bonding L-C-L structure; fabrication process; frequency 57 GHz to 66 GHz; impedance matching; interconnects design; microstrip transmission line; on-board differential patch array antenna; Antenna measurements; Antennas; Bandwidth; Coplanar waveguides; Gain; Substrates; Transmission line measurements; Antenna arrays; boards; interconnects; measurement; packaging; patch antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwaves, Communications, Antennas and Electronics Systems (COMCAS), 2011 IEEE International Conference on

Conference_Location

Tel Aviv

Print_ISBN

978-1-4577-1692-8

Type

conf

DOI

10.1109/COMCAS.2011.6105780

Filename

6105780