Title :
Finite element investigations of mechanical stress in metallization structures
Author :
Weide, K. ; Yu, X. ; Menborn, F.
Author_Institution :
Universitat Hannover
Keywords :
Aluminum; Conducting materials; Current density; Finite element methods; Metallization; Plugs; Temperature; Thermal expansion; Thermal stresses; Tungsten;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888196
