DocumentCode
2684971
Title
A new method to determine the influence of thermomechanical stress on the reliability of metal lines in integrated circuits
Author
Glasow, A.v. ; Kammer, H. ; Kohlhase, A.
Author_Institution
SIEMENS AG, Semiconductor Group
fYear
1996
fDate
1996
Firstpage
1755
Lastpage
1758
Keywords
Aluminum alloys; Capacitive sensors; Electromigration; Integrated circuit reliability; Temperature; Tensile stress; Testing; Thermal stresses; Thermomechanical processes; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN
0-7803-3369-1
Type
conf
DOI
10.1109/ESREF.1996.888209
Filename
888209
Link To Document