DocumentCode
2685132
Title
Characterisation of chip-on-board and flip chip packaging technologies by acoustic microscopy
Author
Lawton, W. ; Barrett, J.
Author_Institution
University College
fYear
1996
fDate
1996
Firstpage
1803
Lastpage
1806
Keywords
Acoustic devices; Assembly; Delamination; Electronic packaging thermal management; Electronics packaging; Flip chip; Inspection; Microelectronics; Optical microscopy; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN
0-7803-3369-1
Type
conf
DOI
10.1109/ESREF.1996.888219
Filename
888219
Link To Document