DocumentCode :
2685369
Title :
Design of a test structure to evaluate electro-thermomigration in power ICs
Author :
De Munari, I. ; Speroni, F. ; Reverberi, M. ; Neva, C. ; Lonz, L. ; Fantini, F.
Author_Institution :
Univ. di Parmna
fYear :
1996
fDate :
1996
Firstpage :
1875
Lastpage :
1878
Keywords :
Chemicals; Circuit testing; Current density; Electromigration; Heating; Integrated circuit reliability; Power integrated circuits; Silicon; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
Type :
conf
DOI :
10.1109/ESREF.1996.888236
Filename :
888236
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2685369
بازگشت