Ultrasonic bonding of polymer microfluidic chips

Author

Zhang, Zong-bo ; Luo, Yi ; Wang, Xiao-dong ; Zhang, Zhen-qiang ; Wang, Li-ding

Author_Institution

Non-traditional Machining of Minist. of Educ., Dalian Univ. of Technol. Precision, Dalian

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

5

Abstract

Bonding is an essential step to enclose microchannels or microchambers in lab-on-a-chip. Ultrasonic bonding was studied as a deformation-free technique to realize high efficiency bonding of microfluidic chips. Based on viscoelastic dissipation theory, the main influential factors of heat generation rate during ultrasonic bonding was theoretically analyzed and numerically calculated using finite element method. According to the results, micro energy directors were designed to concentrate the ultrasonic power and to control the location of the joint. To demonstrate the performance of this bonding method, specially designed PMMA substrates of microfluidic chips were fabricated by means of hot embossing. With the ultrasonic bonding technique, the chips were reliably and hermetically bonded within less than a second.

Keywords

embossing; finite element analysis; hermetic seals; lab-on-a-chip; microfluidics; ultrasonic bonding; viscoelasticity; PMMA substrates; deformation-free technique; finite element method; heat generation rate; hermetic bonding; hot embossing; lab-on-a-chip; micro energy directors; microchambers; microchannels; polymer microfluidic chips; ultrasonic bonding; viscoelastic dissipation theory; Bonding; Design methodology; Elasticity; Embossing; Finite element methods; Lab-on-a-chip; Microchannel; Microfluidics; Polymers; Viscosity; Ultrasonic bonding; finite element method; hot embossing; microfluidic chips;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4606937

Filename

4606937