DocumentCode
2685469
Title
New technologies for advanced high density 3D packaging by using TSV process
Author
Kettner, Paul ; Kim, Bioh ; Pargfrieder, Stefan ; Zhu, Swen
Author_Institution
EV Group, St. Florian
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
3
Abstract
There is no question that 3D integration will be the next generation of packaging. This requires new technologies from ultra thin wafer handling to wafer to wafer bonding with 3D inter substrate connections. TSV is a process in which wafers are thinned, stacked and interconnected to significantly improve electrical performance such as signal transmission, interconnect density, reduced power consumption, form factor and manufacturing costs.
Keywords
chip scale packaging; wafer bonding; wafer level packaging; TSV; form factor; high density 3D packaging; interconnect density; power consumption; signal transmission; ultra thin wafer handling; wafer bonding; CMOS technology; Cost function; Electronics packaging; Energy consumption; Integrated circuit packaging; Protection; Temperature; Thermal resistance; Through-silicon vias; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4606939
Filename
4606939
Link To Document