LTCC Vertical Interconnection Modeling by Multi-dimensional Cauchy Approximation

Author

Xia, Lei ; Zhang, Yixia ; Xu, Ruimin

Author_Institution

EHF key Lab. of Fundamental Sci., Univ. of Electron. Sci. & Technol. of China, Chengdu, China

fYear

2012

fDate

27-29 Oct. 2012

Firstpage

856

Lastpage

858

Abstract

Multidimensional Cauchy approximation is adapted in modeling process to characterize the RF performance of the low temperature co-fired ceramic (LTCC) interconnection structure. The Cauchy approximation function forms a surrogate to express the input and output mapping relation. The parameters of the multi-dimensional Cauchy rational polynomial can be confirmed by solving the convex program problem. A grounded coplanar wave guide (GCPW) vertical interconnection structure model is developed by this method, and the result shows the developed model perform a better predictive performance.

Keywords

approximation theory; convex programming; coplanar waveguides; radiofrequency interconnections; Cauchy approximation function; GCPW vertical interconnection structure model; LTCC interconnection structure; LTCC vertical interconnection modeling; RF performance; convex program problem; grounded coplanar wave guide vertical interconnection structure model; input mapping relation; low temperature cofired ceramic interconnection structure; modeling process; multidimensional Cauchy approximation; multidimensional Cauchy rational polynomial; output mapping relation; predictive performance; Approximation methods; Computational modeling; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Microwave circuits; Cauchy approximation; LTCC; modeling; vertical interconnection;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer and Information Technology (CIT), 2012 IEEE 12th International Conference on

Conference_Location

Chengdu

Print_ISBN

978-1-4673-4873-7

Type

conf

DOI

10.1109/CIT.2012.178

Filename

6392014