DocumentCode
2685524
Title
SiP/SoP technology and its implementation
Author
Wan, Lixi
Author_Institution
Inst. of Microelectron., Chinese Acad. of Sci., Beijing
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
3
Abstract
ldquoSystem-in-packagerdquo(SiP) and ldquosystem-on-packagerdquo (SoP) are different but similar in concepts. SiP and SoP definition were found in many open sources. SoP promises much more technologies and functions over SiP, leads to too many and more complicated research areas, and long time to develop, which could lost patience and interest from industry. Module-in-package(MiP) was proposed as a replacement of SoP for real implementations.
Keywords
system-in-package; module-in-package; system-in-package; system-on-package; Assembly systems; Capacitors; Electronic components; Electronics packaging; Microelectronics; Micromechanical devices; Optical devices; Partial response channels; Radio frequency; Substrates; Module-in-Package; System-in-Package; System-on-Package;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4606942
Filename
4606942
Link To Document