Title :
The study on the parameters change of electronic components under long-term storage conditions by accelerated test
Author :
Zhang, Xiaoling ; Xie, Xuesong ; Lv, Changzhi ; Li, Zhiguo
Author_Institution :
Sch. of Elec. Inf. & Auto., Beijing Univ. of Technol., Beijing, China
Abstract :
In this paper, a test method of accelerated stress through temperature and humidity was designed. For the 3DK10 NPN transistors of package with and without painting, the life test was continuous for 115 hours under 125°C and 95% humidity. In the result, the parameters of all transistors are not obviously changed, at the same time, we found the package painting is strong hygroscopic which has a large effect on the reliability of the devices in high humidity. At last, we compared the parameters of the transistors between the new transistors and ones in storage for over thirty years, the result was described, after long-term storage the output characteristics degrade, the gain of some devices decreases and the gain of some of them increases.
Keywords :
electronics packaging; life testing; semiconductor device reliability; storage; transistors; 3DK10 NPN transistors; accelerated test; electronic components; humidity; long-term storage conditions; package painting; reliability; temperature 125 degC; time 115 h; Humidity; Life estimation; Painting; Reliability; Stress; Temperature measurement; Transistors; bipolar transistor; high humidity and temperature; long-term storage;
Conference_Titel :
Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on
Conference_Location :
Guiyang
Print_ISBN :
978-1-61284-667-5
DOI :
10.1109/ICRMS.2011.5979425