DocumentCode :
2685595
Title :
Question marks to the extrapolation to lower temperatures in high temperature storage life (HTSL) testing in plastic encapsulated IC´S
Author :
Schuddeboom, W. ; Wubbenhorst, M.
fYear :
1996
fDate :
8-11 Oct. 1996
Firstpage :
1935
Lastpage :
1938
Keywords :
Chemical technology; Circuit testing; Corrosion; Extrapolation; Life testing; Materials science and technology; Packaging; Plastics; Tellurium; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Conference_Location :
Enschede, The Netherlands
Print_ISBN :
0-7803-3369-1
Type :
conf
DOI :
10.1109/ESREF.1996.888249
Filename :
888249
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2685595
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