DocumentCode
2685595
Title
Question marks to the extrapolation to lower temperatures in high temperature storage life (HTSL) testing in plastic encapsulated IC´S
Author
Schuddeboom, W. ; Wubbenhorst, M.
fYear
1996
fDate
8-11 Oct. 1996
Firstpage
1935
Lastpage
1938
Keywords
Chemical technology; Circuit testing; Corrosion; Extrapolation; Life testing; Materials science and technology; Packaging; Plastics; Tellurium; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Conference_Location
Enschede, The Netherlands
Print_ISBN
0-7803-3369-1
Type
conf
DOI
10.1109/ESREF.1996.888249
Filename
888249
Link To Document