DocumentCode
2685690
Title
DPA tests on SiP device
Author
Ling, Jin ; Jun, Hu ; Li, Han
Author_Institution
Guangdong Yuejing High-Tech Co., Ltd., Guangzhou
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
3
Abstract
The reliability of multi-dice in package was studied in this paper; DPA tests were operated on qualified devices to distribute early failure from overstress failure. Then factorial experiments manipulated on early failure samples for failure analysis. Comparing the C-SAM images before and after a series reliability tests, the reliability of SiP devices was confirmed.
Keywords
integrated circuit reliability; system-in-package; C-SAM images; DPA tests; SiP device; multi-dice in package; Delamination; Electronic equipment testing; Failure analysis; Life testing; Materials testing; Packaging; Production; Resistors; Temperature; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4606953
Filename
4606953
Link To Document