DocumentCode
2685691
Title
Modeling and simulating the dynamic electrothermal behavior of power electronic circuits using bond graphs
Author
Garcia, Janette ; Dauphin Tanguy, G. ; Rombaut, Christian
Author_Institution
Ecole Centrale de Lille, Villeneuve d´´Ascq, France
Volume
2
fYear
1996
fDate
23-27 Jun 1996
Firstpage
1641
Abstract
This paper describes the modeling of the electrical and thermal behavior of semiconductor switching devices using bond graphs. An effective way to identify the parameters of the thermal system is presented. The model shows good consistency with measurements of the junction temperature response in steady state as well as in transient state
Keywords
bond graphs; p-n junctions; parameter estimation; power semiconductor switches; semiconductor device models; thermal analysis; bond graphs; dynamic electrothermal behavior; junction temperature response; parameters identification; power electronic circuits; semiconductor switching devices; steady-state; transient-state; Bonding; Circuit simulation; Differential equations; Electrothermal effects; Parameter estimation; Power electronics; Power semiconductor switches; Power system modeling; Switching circuits; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 1996. PESC '96 Record., 27th Annual IEEE
Conference_Location
Baveno
ISSN
0275-9306
Print_ISBN
0-7803-3500-7
Type
conf
DOI
10.1109/PESC.1996.548801
Filename
548801
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