Title :
Modeling and simulating the dynamic electrothermal behavior of power electronic circuits using bond graphs
Author :
Garcia, Janette ; Dauphin Tanguy, G. ; Rombaut, Christian
Author_Institution :
Ecole Centrale de Lille, Villeneuve d´´Ascq, France
Abstract :
This paper describes the modeling of the electrical and thermal behavior of semiconductor switching devices using bond graphs. An effective way to identify the parameters of the thermal system is presented. The model shows good consistency with measurements of the junction temperature response in steady state as well as in transient state
Keywords :
bond graphs; p-n junctions; parameter estimation; power semiconductor switches; semiconductor device models; thermal analysis; bond graphs; dynamic electrothermal behavior; junction temperature response; parameters identification; power electronic circuits; semiconductor switching devices; steady-state; transient-state; Bonding; Circuit simulation; Differential equations; Electrothermal effects; Parameter estimation; Power electronics; Power semiconductor switches; Power system modeling; Switching circuits; Temperature measurement;
Conference_Titel :
Power Electronics Specialists Conference, 1996. PESC '96 Record., 27th Annual IEEE
Conference_Location :
Baveno
Print_ISBN :
0-7803-3500-7
DOI :
10.1109/PESC.1996.548801
