DocumentCode
2685709
Title
Quality assurance of S-parameters and rational function models for transient simulations
Author
Sanghoek Kim ; Romo Luevano, Gerardo ; Roselle, Kevin ; Michalka, Tim
Author_Institution
CORP ENG - Signal Integrity Anal., Qualcomm Inc., San Diego, CA, USA
fYear
2015
fDate
15-21 March 2015
Firstpage
40
Lastpage
45
Abstract
S-parameters of electrical networks are often extracted using an electromagnetic (EM) simulator, and imported directly or after conversion to rational function models into a transient circuit simulator. However, there are several issues related to frequency-defined models that might prevent successful transient simulation. In this work, the requirements for S-parameter and rational function models in the frequency domain leading to successful transient simulations are studied in detail. Application examples of corrupted transient simulation results due to failure to meet these requirements are presented. This work also presents a quality assurance methodology to ensure that S-parameter and rational function models satisfy such necessary requirements. In particular, a new method is proposed to check the DC values of S-parameters obtained from EM simulation.
Keywords
S-parameters; electronics packaging; power electronics; quality assurance; rational functions; S-parameters; electrical networks; electromagnetic simulator; quality assurance; rational function models; transient simulations; Frequency-domain analysis; Integrated circuit modeling; Mathematical model; Numerical models; Ports (Computers); Scattering parameters; Transient analysis; DC point; PDN; S-parameter; causality; interconnect; passivity; power delivery network; power integrity; quality assurance; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-1992-5
Type
conf
DOI
10.1109/EMCSI.2015.7107656
Filename
7107656
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