Title :
Introduction of Microelectronics Manufacturing Engineering into professional education: a joint effort among industry, government and universities
Author :
Pan, Kailin ; Yang, Daoguo ; Kai, Qiao ; Zhang, Kouchi ; Yang, Lianfa
Author_Institution :
Sch. of Mech. Eng., Guilin Univ. of Electron. Technol., Guilin
Abstract :
In order to promote the professional education and meet the requirements for the well-qualified technicians of the microelectronics industry , the higher education division of the education ministry and Intel (China) jointly initiated and setup a new mode of higher professional education faculty training:ldquo2008 Microelectronics Manufacturing Engineering Faculty Training Camprdquo, of which the ldquoIntel-GUET Microelectronics Packaging & Assembly Technology Faculty Training Camprdquo was organized and implemented by Guilin University of Electronic Technology (GUET). The program includes three parts: basic theories and experiments, one weekpsilas industry visit & investigation, and one weekpsilas education reform discussion & forum. In this paper, the initiatives, curriculum structure, and hands-on training, etc. were presented. The activities and the achievements of this joint faculty training are summarized.
Keywords :
electronic engineering education; training; curriculum structure; faculty training; hands-on training; microelectronics manufacturing engineering; professional education; Assembly; Educational institutions; Educational programs; Educational technology; Electronics industry; Electronics packaging; Government; Industrial training; Manufacturing industries; Microelectronics;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606961