• DocumentCode
    2685852
  • Title

    Introduction of Microelectronics Manufacturing Engineering into professional education: a joint effort among industry, government and universities

  • Author

    Pan, Kailin ; Yang, Daoguo ; Kai, Qiao ; Zhang, Kouchi ; Yang, Lianfa

  • Author_Institution
    Sch. of Mech. Eng., Guilin Univ. of Electron. Technol., Guilin
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In order to promote the professional education and meet the requirements for the well-qualified technicians of the microelectronics industry , the higher education division of the education ministry and Intel (China) jointly initiated and setup a new mode of higher professional education faculty training:ldquo2008 Microelectronics Manufacturing Engineering Faculty Training Camprdquo, of which the ldquoIntel-GUET Microelectronics Packaging & Assembly Technology Faculty Training Camprdquo was organized and implemented by Guilin University of Electronic Technology (GUET). The program includes three parts: basic theories and experiments, one weekpsilas industry visit & investigation, and one weekpsilas education reform discussion & forum. In this paper, the initiatives, curriculum structure, and hands-on training, etc. were presented. The activities and the achievements of this joint faculty training are summarized.
  • Keywords
    electronic engineering education; training; curriculum structure; faculty training; hands-on training; microelectronics manufacturing engineering; professional education; Assembly; Educational institutions; Educational programs; Educational technology; Electronics industry; Electronics packaging; Government; Industrial training; Manufacturing industries; Microelectronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4606961
  • Filename
    4606961