Thermal management and testing of MCM with embedded chip in silicon substrate

Author

Geng, Fei ; Tang, Jia-jie ; Luo, Le

Author_Institution

ShangHai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

6

Abstract

In this paper the thermal management and testing of MCM with embedded chip in Si substrate was performed. Regarding the interconnection structure of the module, a benzocyclobutene (BCB) film covers the multichip modules as dielectric layer and Au soldered balls are utilized for multi-layer vertical interconnection. The thermal resistance and junction temperature are simulated and tested respectively. The results show that the thermal resistance is between 0.7degC/W and 1degC/W dependent on the use of a additional heat sink and the optimization of the parameters.

Keywords

heat sinks; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; monolithic integrated circuits; multichip modules; thermal management (packaging); thermal resistance; MCM testing; Si; benzocyclobutene film; dielectric layer; embedded chip; heat sink; junction temperature; multichip modules; multilayer vertical interconnection; silicon substrate; soldered balls; thermal management; thermal resistance; Dielectric substrates; Gold; Multichip modules; Performance evaluation; Resistance heating; Silicon; Temperature; Testing; Thermal management; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4606966

Filename

4606966