Title :
Dynamic bending tests and numerical simulation of board level electronic package
Author :
Fei, Qin ; Yngve, Wang ; Bin, Liu ; Tong, An ; Ling, Jin
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing
Abstract :
4-point dynamic bending tests of board level electronic packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data. A parameter study was subsequently implemented. The results show that at certain value of PCB stiffness the peeling stress reaches its peak. The package installation angel has significant effect on the peeling stress of the solder joints.
Keywords :
bending; circuit reliability; circuit simulation; electronics packaging; finite element analysis; printed circuit testing; solders; 4-point dynamic bending tests; PCB board; board level electronic package; digital image correlation method; finite element model; high-speed camera; package installation angel; peeling stress; solder joints; stiffness; Correlation; Digital cameras; Digital images; Electronic equipment testing; Electronics packaging; Finite element methods; Numerical simulation; Soldering; Stress; Velocity measurement;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4606969
