DocumentCode :
2686238
Title :
4H-SiC SIT device for RF heating applications
Author :
Ortolland, S. ; Johnson, C.M.
Author_Institution :
Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
fYear :
1999
fDate :
36186
Firstpage :
42401
Lastpage :
42404
Abstract :
In this paper, the optimisation procedure for a static induction transistor (SIT) in silicon carbide is described and its application in a typical RF heating circuit is presented. A field plate edge termination is optimised for a 10 μm thick epitaxial layer with doping in the range 1015 cm-3 to 1016 cm-3. Results show a breakdown voltage of 1280 V, corresponding to 68% of the theoretical value. For the chosen application an epitaxial layer doping level of 5×1015 cm-3 is revealed to offer the best compromise. This allows pinch off of drain voltages exceeding 600 V from a 20 V gate drive whilst achieving a current density of 250 A/cm2 at an on-state voltage of less than 1 V. Transient simulations are performed for a series load resonant converter using SiC SITs or silicon MOSFET with a switching frequency of 27.12 MHz. The results emphasise the suitability of the SIT for RF heating applications
Keywords :
static induction transistors; 10 micron; 1280 V; 27.12 MHz; RF heating applications; SIT device; SiC; breakdown voltage; current density; drain voltages; epitaxial layer; field plate edge termination; on-state voltage; optimisation procedure; pinch off; series load resonant converter; switching frequency;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Advances in Semiconductor Devices (Ref. No. 1999/025), IEE Colloquium on
Conference_Location :
London
Type :
conf
DOI :
10.1049/ic:19990150
Filename :
755806
Link To Document :
بازگشت