• DocumentCode
    2686260
  • Title

    A 1.74 ppm/°C, high PSRR bandgap reference with fast start-up

  • Author

    Zhou, Zekun ; Wang, Huiying ; Mei, Xiaohan ; Chen, Cheng ; Zhang, Bo

  • Author_Institution
    State key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2011
  • fDate
    7-9 Nov. 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A novel BiCMOS bandgap reference (BGR) with low temperature coefficient (TC), high power supply rejection ratio (PSRR) and fast start-up is presented in this paper. Utilizing the currents´ temperature characteristics of BJTs in active region and MOS FETs in subthreshold region, the temperature drift of the proposed BGR is greatly reduced in full temperature range. This method focuses on achieving several points with zero TC on the curve of reference voltage instead of single valley or peak in the whole temperature range. Besides, clamping operational amplifier is designed not only to stabilize the loop, but also to reduce the start-up time. The proposed BGR is implemented with 0.6-μm BCD technology, and is validated with Hspice in a temperature range of -45°C ~ 125°C. Simulation results demonstrate that a TC of 1.74ppm/°C is realized, and a PSRR of 87dB is achieved. The start-up time of the proposed BGR is only 8us at room temperature.
  • Keywords
    BiCMOS integrated circuits; MOSFET; SPICE; bipolar transistors; operational amplifiers; 0.6-μm BCD technology; BiCMOS bandgap reference; Hspice; MOS FET; clamping operational amplifier; current temperature characteristic; high PSRR bandgap reference; high power supply rejection ratio; low temperature coefficient; size 0.5 mum; Clamps; Equations; Operational amplifiers; Photonic band gap; Power supplies; Temperature distribution; fast start-up; high PSRR; high-order curvature compensation; low TC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwaves, Communications, Antennas and Electronics Systems (COMCAS), 2011 IEEE International Conference on
  • Conference_Location
    Tel Aviv
  • Print_ISBN
    978-1-4577-1692-8
  • Type

    conf

  • DOI
    10.1109/COMCAS.2011.6105881
  • Filename
    6105881