An analysis and design approach of a modified high frequency GaAs air bridge process for low cost assembly applications

Decreasing time to market, improving electrical performance, and decreasing overall costs are primary driving forces in semiconductor markets. The purpose of this paper is to demonstrate how changes made to the fabrication process of an existing production GaAs technology enables quicker development time while maintaining the design kit and model infrastructure. This updated technology enables packaging of high frequency devices using high volume, low cost assembly techniques. The fabrication changes will be described as well as the design modifications necessary to simulate, test, and model the devices.