Title :
Up date on cleanliness of electronic assemblies
Author :
Lepagnol, Jean H.
Author_Institution :
Alpha Metals, Noisy le Sec, France
Abstract :
Various issues connected with the cleanliness conditions and cleaning of electronic assemblies are addressed. Presoldering and soldering procedures are examined. The cleaning operation is described. Methods for the technical assessment of cleanliness are discussed. They consist of measuring ionic contamination and measuring surface insulation resistance. Typical levels of cleanliness obtained with various types of fluxes and cleaning processes are tabulated. The cost of cleaning is considered.<>
Keywords :
printed circuit manufacture; quality control; soldering; surface mount technology; assessment of cleanliness; cleaning of electronic assemblies; cleaning operation; cleaning processes; cleanliness conditions; cleanliness of electronic assemblies; cost of cleaning; measuring ionic contamination; measuring surface insulation resistance; presoldering procedures; soldering procedures; types of fluxes; Assembly; Chemical processes; Conductors; Insulation; Printed circuits; Production; Soldering; Surface cleaning; Surface contamination; Surface resistance;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171044
