DocumentCode :
2686915
Title :
A novel high effective envelope-tracking amplifier for OFDM systems
Author :
Li, Yingliang ; Jide-Zhao
Author_Institution :
Motorola Hangzhou R&D Center, Hangzhou
fYear :
2008
fDate :
28-31 July 2008
Firstpage :
1
Lastpage :
3
Abstract :
OFDM (orthogonal frequency division multiplex) mobile communication system is so popular in recent because it has so many virtues as effective frequency spectrum, wide-band, high speed rate, etc. But it has so many challenges in technical field, such as the high efficiency of PA (power amplifier) and linearity. RF (radio frequency) amplifier with ET (envelop-tracing) structure is described for OFDM systems in this paper. The first study the ET amplifier model, and then a high-efficiency OFDM amplifier is presented with GaN HEMT (heterostrucutre field-effect transistors), and includes the theoretic analysis and circuit design. Finally, the design circuit is simulated by ADS (advanced design systems) software, and gets the average DE (drains efficiency) of the amplifier is as high as 50% for an OFDM (Wimax) modulated signal with EVM of 2.94% at an average output power of 50 W and gain of 13.0 dB from simulating result. The design has good efficiency and linearity. All of these performances are satisfied with the OFDM systempsilas requirement of RF. This design may be applied for the OFDM systems compare with the standard of OFDM.
Keywords :
HEMT circuits; III-V semiconductors; OFDM modulation; WiMax; circuit CAD; gallium compounds; mobile communication; power amplifiers; wide band gap semiconductors; GaN; OFDM systems; WiMax; advanced design system software; circuit design; envelope-tracking amplifier; gain 13.0 dB; heterostrucutre field-effect transistors; mobile communication; orthogonal frequency division multiplex; power 50 W; power amplifier; radiofrequency amplifiers; Broadband amplifiers; Circuit simulation; Frequency division multiplexing; High power amplifiers; Linearity; Mobile communication; OFDM; Radio frequency; Radiofrequency amplifiers; Signal design; Amplifier; Envelop tracing; OFDM; Wimax;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
Type :
conf
DOI :
10.1109/ICEPT.2008.4607026
Filename :
4607026
Link To Document :
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