Title :
Thermal management of a multi-core master processing unit (MPU) for an ultrascalable computing platform
Author :
Cheng, Ting ; Xiong, Wei ; Luo, Xiaobing ; Huang, Suyi ; Gan, Zhiyin ; Liu, Sheng
Author_Institution :
Sch. of Power & Energy Eng., Huazhong Univ. of Sci. & Technol, Wuhan
Abstract :
Thermal management of a super computer is one key point in the whole system design. The working temperature of electronic device in the super computer is the important parameter to show the cooling performance. Thermal design was conducted for one super computer. The experiment was conducted to test the temperature of an ultrascalable computing platform in order to evaluate the cooling performance, the results demonstrate that the thermal management by such a simple method is good.
Keywords :
cooling; mainframes; thermal management (packaging); cooling; electronic device; multicore master processing unit; super computer; system design; thermal management; ultrascalable computing; Cooling; Energy management; Fans; Heat sinks; Temperature; Testing; Thermal conductivity; Thermal engineering; Thermal management; Thermal management of electronics;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607036
