Thermal management of a multi-core master processing unit (MPU) for an ultrascalable computing platform

Author

Cheng, Ting ; Xiong, Wei ; Luo, Xiaobing ; Huang, Suyi ; Gan, Zhiyin ; Liu, Sheng

Author_Institution

Sch. of Power & Energy Eng., Huazhong Univ. of Sci. & Technol, Wuhan

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

3

Abstract

Thermal management of a super computer is one key point in the whole system design. The working temperature of electronic device in the super computer is the important parameter to show the cooling performance. Thermal design was conducted for one super computer. The experiment was conducted to test the temperature of an ultrascalable computing platform in order to evaluate the cooling performance, the results demonstrate that the thermal management by such a simple method is good.

Keywords

cooling; mainframes; thermal management (packaging); cooling; electronic device; multicore master processing unit; super computer; system design; thermal management; ultrascalable computing; Cooling; Energy management; Fans; Heat sinks; Temperature; Testing; Thermal conductivity; Thermal engineering; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607036

Filename

4607036