DocumentCode :
2687248
Title :
Structural and electrical properties of iron-silicide thin film resistor deposited by cosputtering
Author :
Sorimachi, Y. ; Honda, K. ; Tusbata, I. ; Inose, Y. Ich ; Miyauchi, Shoko
Author_Institution :
Nagaoka Univ. of Technol., Niigata, Japan
fYear :
1990
fDate :
0-0 1990
Firstpage :
414
Lastpage :
418
Abstract :
The sheet resistance, TCR, thermoelectric power, and frequency characteristics of cosputtered iron-silicide thin film are examined. The values of sheet resistance and TCR for 1000-AA thick films are 20 Omega to 30 Omega and +200 to -4000 ppm/ degrees C, respectively, depending on composition in the range of 48 to 68 at.% Si. In particular, zero TCR film is formed at the composition of 54 at.% Si, and the film structure is considered to consist of FeSi and FeSi/sub 2/, which have positive and negative TCR, respectively.<>
Keywords :
iron compounds; sputter deposition; sputtered coatings; thin film resistors; FeSi-FeSi/sub 2/; TCR; composition; cosputtering; electrical properties; film structure; frequency characteristics; sheet resistance; silicides; structural properties; thermoelectric power; thin film resistor; zero TCR film; Conductivity; Electric resistance; Electrical resistance measurement; Frequency; Iron; Resistors; Semiconductor films; Sputtering; Thermal resistance; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
Type :
conf
DOI :
10.1109/IEMT8.1990.171046
Filename :
171046
Link To Document :
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