Title :
Manufacture, microstructure and microhardness analysis of Sn-Bi lead-free solder reinforced with Sn-Ag-Cu nano-particles
Author :
Zhang, Lili ; Tao, Wenkai ; Liu, Johan ; Zhang, Yan ; Cheng, Zhaonian ; Andersson, Cristina ; Gao, Yulai ; Zhai, Qijie
Author_Institution :
Key Lab. of Adv. Display & Syst. Applic. & SMIT Center, Shanghai Univ., Shanghai
Abstract :
This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed consumable-electrode direct current arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between 20 and 80 nm are prepared. The reinforced lead-free Sn-Bi solder was prepared by thoroughly blending the nanometer-sized SAC particles into the eutectic Sn-Bi solder paste. The SAC reinforced Sn-Bi composite solder paste was printed onto ENIG/Cu metalized substrate and reflowed in a conventional reflow oven. After reflow, the morphology of the as-solidified reinforced composite solder was observed by means of SEM and TEM. The Vickers microhardness measurements indicated that the addition of SAC nano-particles enhances the overall strength of the eutectic solder, and the results agree well with the theory of dispersion strengthening.
Keywords :
Vickers hardness; bismuth alloys; copper alloys; crystal microstructure; dispersion hardening; microhardness; nanocomposites; nanoparticles; particle reinforced composites; particle size; scanning electron microscopy; silver alloys; solders; tin alloys; transmission electron microscopy; ENIG/Cu metalized substrate; SEM; SnAgCu-SnBi; TEM; Vickers microhardness; blending; composite solders; consumable-electrode direct current arc; dispersion strengthening; eutectic solder; microstructure; morphology; nanoparticle reinforced lead-free solder; particle size; reflow oven; Displays; Environmentally friendly manufacturing techniques; Intermetallic; Laboratories; Lead; Mechanical factors; Microstructure; Morphology; Soldering; Testing;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607057
