• DocumentCode
    2687440
  • Title

    Synthesis of high purity o-cresol novolac epoxy resins

  • Author

    Tian, Xiao-Wei ; Yang, Zhen-Guo ; Sun, Jiang-Yan ; Ji, Zheng

  • Author_Institution
    Dept. of Mater. Sci., Fudan Univ., Shanghai
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    O-cresol novolac epoxy resins are used widely as electronic encapsulating materials. When the pitch wires in electronic systems are more slender, there are pressing demands for high purity o-cresol novolac epoxy resin which are with little content of hydrolyzable chloride. In this paper, o-cresol novolac resin was synthesized from para-formaldehyde and o-cresol in the presence of a mixed catalyst (oxalic acid and another co-catalyst). Then, the resultant resin was further reacted with epichlorohydrin to prepare o-cresol novolac epoxy resin. The performances and structure of o-cresol novolac resin and o-cresol novolac epoxy resin were characterized by epoxy equivalent weight, softening point, the content of hydrolyzable chloride and inorganic chlorine, FTIR, 13CNMR. And the relationships between the performances and the reaction conditions were also studied. The results indicate that, o-cresol novolac epoxy resins were synthesized with certain performances through the adjustment of the reaction conditions, which were suited for the pressing demands for high purity applications.
  • Keywords
    Fourier transform spectra; catalysis; catalysts; infrared spectra; nuclear magnetic resonance; polymerisation; polymers; FTIR; NMR; epichlorohydrin; equivalent weight; hydrolyzable chloride; inorganic chlorine; mixed catalyst; o-cresol novolac epoxy resin; oxalic acid; para-formaldehyde; softening point; Chemical industry; Epoxy resins; Microelectronics; Powders; Pressing; Semiconductor devices; Semiconductor materials; Solvents; Thermal conductivity; Wires; high purity; hydrolyzable halide; o-cresol novolac epoxy resin; o-cresol novolac resin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4607062
  • Filename
    4607062