DocumentCode
2687440
Title
Synthesis of high purity o-cresol novolac epoxy resins
Author
Tian, Xiao-Wei ; Yang, Zhen-Guo ; Sun, Jiang-Yan ; Ji, Zheng
Author_Institution
Dept. of Mater. Sci., Fudan Univ., Shanghai
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
5
Abstract
O-cresol novolac epoxy resins are used widely as electronic encapsulating materials. When the pitch wires in electronic systems are more slender, there are pressing demands for high purity o-cresol novolac epoxy resin which are with little content of hydrolyzable chloride. In this paper, o-cresol novolac resin was synthesized from para-formaldehyde and o-cresol in the presence of a mixed catalyst (oxalic acid and another co-catalyst). Then, the resultant resin was further reacted with epichlorohydrin to prepare o-cresol novolac epoxy resin. The performances and structure of o-cresol novolac resin and o-cresol novolac epoxy resin were characterized by epoxy equivalent weight, softening point, the content of hydrolyzable chloride and inorganic chlorine, FTIR, 13CNMR. And the relationships between the performances and the reaction conditions were also studied. The results indicate that, o-cresol novolac epoxy resins were synthesized with certain performances through the adjustment of the reaction conditions, which were suited for the pressing demands for high purity applications.
Keywords
Fourier transform spectra; catalysis; catalysts; infrared spectra; nuclear magnetic resonance; polymerisation; polymers; FTIR; NMR; epichlorohydrin; equivalent weight; hydrolyzable chloride; inorganic chlorine; mixed catalyst; o-cresol novolac epoxy resin; oxalic acid; para-formaldehyde; softening point; Chemical industry; Epoxy resins; Microelectronics; Powders; Pressing; Semiconductor devices; Semiconductor materials; Solvents; Thermal conductivity; Wires; high purity; hydrolyzable halide; o-cresol novolac epoxy resin; o-cresol novolac resin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4607062
Filename
4607062
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