Thiol based chemical treatment as adhesion promoter for Cu-epoxy interface

Author

Wong, Cell K Y ; Yuen, Matthew M F

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon

fYear

2008

fDate

28-31 July 2008

Firstpage

1

Lastpage

7

Abstract

The paper focuses on the use of thiol as adhesion promoter in Cu-epoxy interface. A parametric study on the thiol deposition procedure for Cu-epoxy system was conducted. Thiol concentration and deposition time was found to be important parameter in adhesion. Low concentrated solution leads to insufficient morphological modification while prolong treatment time results in fracture happened along weak boundary layer. The optimum condition for surface treatment with the current thiol was 5 mM solution for 10 hours. With this thiol treatment, adhesion which was given as fracture toughness has increased from 4.8 Jm^-2 for the untreated sample to 159 Jm^-2. The 30 times adhesion improvement was related to presence of nanostructure upon thiol modification. Both the chemical bonding and morphological changes was found contributes to adhesion.

Keywords

adhesion; bonds (chemical); boundary layers; copper; integrated circuit packaging; surface treatment; adhesion promoter; boundary layer; chemical bonding; epoxy interface; morphological changes; morphological modification; surface treatment; thiol based chemical treatment; Adhesives; Bonding; Chemical technology; Copper; Electromagnetic compatibility; Electronic packaging thermal management; Integrated circuit packaging; Oxidation; Surface morphology; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-2739-0

Electronic_ISBN

978-1-4244-2740-6

Type

conf

DOI

10.1109/ICEPT.2008.4607078

Filename

4607078