Title :
The synthesis and curing kinetics of the silicon-containing epoxy resin with environmentally friendship flame retardance
Author :
Ming-Shan Yang ; Jie He ; Lin-Kai Li ; Zhen Liu
Author_Institution :
Dept. of Mater. Sci. & Eng., Beijing Inst. of Petrochem. Technol., Beijing
Abstract :
Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the -Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which offers basic data for the application of CNE-Si in large-scale circuit packaging.
Keywords :
Fourier transform spectra; chemical structure; curing; differential scanning calorimetry; infrared spectra; integrated circuit packaging; nuclear magnetic resonance; polymer structure; polymers; thermal stability; FTIR spectra; Kissinger method; NMR; Ozawa method; TGA; activation energy; chemical structure; curing kinetics; diphenylsilandiol; epoxy resin; flame retardance; nonisothermal DSC; ortho-cresol novolac; thermal stability; Chemicals; Circuits; Curing; Epoxy resins; Fires; Kinetic theory; Large-scale systems; Stability analysis; Temperature; Thermal stability; Silicon-containing epoxy resin; curing kinetics; synthesis;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607083
