Title :
Chip bumping for rework on FCOB assembly line
Author :
Yang, Zengli ; Viswanadam, Gautham ; Tay, Y.H.
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
This paper proposes a single-chip bumping process for FCOB rework purposes. It uses the same infrastructure as a FCOB assembly line based on the SMT-type flip chip assembly of unbumped chips, without any additional equipment or materials. The issues of chip slippage, missing bumps and their proposed solutions are discussed in this paper
Keywords :
assembling; chip-on-board packaging; flip-chip devices; integrated circuit packaging; maintenance engineering; printed circuit manufacture; soldering; surface mount technology; FCOB assembly line; FCOB assembly line infrastructure; FCOB rework; SMT-type flip chip assembly; chip bumping; chip slippage; missing bumps; rework; single-chip bumping process; unbumped chips; Assembly; Costs; Electronics packaging; Flip chip; Inspection; Microelectronics; Printing; Sawing; Temperature; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.755974
