• DocumentCode
    2687859
  • Title

    Nano-thermal interface material with CNT nano-particles for heat dissipation application

  • Author

    Xu, Li ; Yue, Cong ; Liu, Johan ; Zhang, Yan ; Lu, Xiu Zhen ; Cheng, Zhaonian

  • Author_Institution
    Minist. of Educ.&SMIT Center, Shanghai Univ., Shanghai
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The scanning electron microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.
  • Keywords
    carbon nanotubes; cooling; nanoparticles; nanotechnology; polymer solutions; scanning electron microscopy; thermal conductivity; thermal management (packaging); C; CNT nanoparticles; SEM; carbon nanotube; electronic packaging; electrospinning; heat dissipation; nanofiber preparation; nanothermal interface material; polymer solution; polyurethane; scanning electron microscopy; thermal conductivity; thermal management; Carbon nanotubes; Conducting materials; Electronic packaging thermal management; Electronics packaging; Nanostructured materials; Polymers; Scanning electron microscopy; Thermal conductivity; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4607085
  • Filename
    4607085