DocumentCode :
2687945
Title :
Best practices in automated underfill dispensing
Author :
Lewis, Alan ; Babiarz, Alec ; Ness, Christian Q. ; Klocke, James
Author_Institution :
Asymtek, Carlsbad, CA, USA
fYear :
1998
fDate :
8-10 Dec 1998
Firstpage :
63
Lastpage :
68
Abstract :
Automating the underfill dispensing process for robust production can be challenging as package sizes decrease, underfill materials advance, and tolerances tighten. The best practices for automated underfill dispensing are discussed for various types of underfill packages. The modern production environment requires “hands-off” calibration and operation. Methods for calibrating dispensing volumes are given and how they affect accuracy and overall process speed are discussed. Differences in automating dispensing for singulated packages and substrates containing multiple die are discussed. Subjects include part heating, automated alignment calibration, and controlling dispensing tolerances. Methods for fillet width control and avoiding air entrapment through the dispensing pattern are given. The advantages of multiple dispensing passes and their limitations on fillet control with fast flowing underfill materials are given. Recommendations for improvement of process speed are discussed. Advantages and disadvantages of various fluid delivery technologies, with supporting data, are given. Time pressure dispensing, auger pump dispensing, and linear piston pump dispensing are included in this discussion. Data is presented which show how the underfill encapsulant rheology can be changed by the dispensing device. The goal is to provide the reader with variety of methods that will help define a robust, production ready process
Keywords :
calibration; computer integrated manufacturing; encapsulation; flip-chip devices; integrated circuit packaging; integrated circuit reliability; multichip modules; process control; process heating; rheology; air entrapment; auger pump dispensing; automated alignment calibration; automated underfill dispensing; automated underfill dispensing practices; dispensing device; dispensing pattern; dispensing tolerance control; dispensing volume calibration; fillet control; fillet width control; fluid delivery technologies; hands-off calibration; linear piston pump dispensing; multiple die substrates; multiple dispensing passes; package size; part heating; process accuracy; process speed; process tolerances; production environment; production ready process; robust production; singulated packages; time pressure dispensing; underfill dispensing process; underfill encapsulant rheology; underfill material flow; underfill materials; underfill packages; Automatic control; Best practices; Calibration; Fluid flow control; Heating; Packaging; Production; Pumps; Robustness; Temperature control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
Type :
conf
DOI :
10.1109/EPTC.1998.755980
Filename :
755980
Link To Document :
بازگشت