Low T/sub g/ epoxy adhesives for thermal management

The functional analysis of adhesives in microelectronics is considered. The authors then address the thermally induced stress on the microelectronic product at all levels of packaging, with major emphasis on component and substrate levels. They demonstrate various ways of reducing or eliminating this stress, which is a major cause of device failure. One of the proven methods is through the use of low T/sub g/ epoxies with high thermal stability. Attention is given to thermal management in connection with multichip modules.<>