Title :
Flip chip on board mounting processes using anisotropic conductive adhesives and eutectic solder
Author :
Zhong, Zhaowei ; Wong, Stephen
Author_Institution :
Gintic Inst. of Manuf. Technol., Singapore
Abstract :
In this study, flip chip on board evaluations were carried out using Taguchi design of experiments. Simple but high yield procedures for rework of flip chip on board using anisotropic conductive adhesives and anisotropic conductive films were developed. Underfill and encapsulation processes for flip chip on board using eutectic solder bumps were also evaluated. The flip chips were assembled on test vehicles for temperature cycling and high temperature/high humidity tests. The reliability performance of the three processes-gold bumps with anisotropic conductive film, anisotropic conductive adhesive, and eutectic solder with underfill-is also discussed in this paper
Keywords :
Taguchi methods; adhesives; chip-on-board packaging; conducting polymers; design of experiments; encapsulation; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; maintenance engineering; microassembling; soldering; thermal stresses; Taguchi design of experiments; anisotropic conductive adhesives; anisotropic conductive films; encapsulation processes; eutectic solder; eutectic solder bumps; flip chip assembly; flip chip on board; flip chip on board mounting processes; gold bumps; high temperature/high humidity tests; high yield procedures; reliability performance; rework; temperature cycling tests; test vehicles; underfill processes; Anisotropic conductive films; Anisotropic magnetoresistance; Assembly; Conductive adhesives; Encapsulation; Flip chip; Humidity; Temperature; Testing; Vehicles;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.755982
