Title :
Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging
Author :
Xiu, Ziyang ; Chen, Guoqin ; Deng, Zongquan ; Gaohui Wu
Author_Institution :
Res. Acad. of Sci. & Technol., Harbin Inst. of Technol., Harbin
Abstract :
Sip/1199Al composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. The microstructure observation showed that the composites were dense and Si particles distributed uniformly; The linear CTEs of Sip/1199 composites was between (8.1~12) times 10-6degC-1, and they were decreased with the increasing content of Si particles as well as annealing treatment; the thermal conductivity can reach 150 W/ (mmiddotdegC), which was decreased with the increasing contents of Si particles as well as annealing treatment. The composites had excellent mechanical properties and also could be recycled.
Keywords :
aluminium; annealing; composite materials; electronics packaging; thermal conductivity; Al; CTE; Sip/1199 composites; annealing treatment; electronic packaging; squeeze-casting technology; thermal conductivity; Aerospace industry; Aerospace materials; Conducting materials; Electronic packaging thermal management; Electronics packaging; Materials science and technology; Mechanical factors; Microstructure; Optical microscopy; Thermal conductivity;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607091
