A novel method for simultaneous switching noise analysis in electronic packages

Author

Zhang, Juyong ; Iyer, Mahadevan K. ; Ooi, Ban Leong ; Leong, Mook Seng

Author_Institution

Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore

fYear

1998

fDate

8-10 Dec 1998

Firstpage

95

Lastpage

98

Abstract

In this paper, a novel method is described for simultaneous switching noise (SSN) analysis in a 208 pin plastic quad flat package (PQFP). A two-port S matrix of the pins, and the coupling between the pins are modelled by analytical equations. SSN is analysed as a function of switching drivers and switching time. Numerical results are presented in this paper. The application of Microwave Design System (MDS) and High Frequency Structure Simulator (HFSS) for modelling and simulation of SSN are presented in this paper

Keywords

S-parameters; circuit simulation; digital integrated circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; numerical analysis; plastic packaging; software tools; switching; High Frequency Structure Simulator; Microwave Design System; PQFP; SSN analysis; analytical equations; electronic packages; modelling; numerical analysis; pin coupling model; plastic quad flat package; silicon digital packaging; simulation; simultaneous switching noise analysis; switching drivers; switching time; two-port S matrix; Circuit simulation; Communication switching; Crosstalk; Electronics packaging; Frequency; Inductance; Matrix converters; Microwave communication; Pins; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 1998. Proceedings of 2nd

Print_ISBN

0-7803-5141-X

Type

conf

DOI

10.1109/EPTC.1998.755985

Filename

755985