Application of embedded components in package substrate

With the high development of IC industry, the size of IC is reduced and the package density is improved continuously. All of these propose higher requests to package substrate. The development directions of package substrate are miniaturization, ultrathin and multi-layer. Embedded components technology, which includes two types: embedded passive and active components, has applied to package substrate. Since passive components account for large quantity, research of embedded passive components in package substrate is got recognition. Embedded capacitance and resistance technology is studied comprehensively. This paper introduced the process of embedded components (capacitance and resistance) with an application example, and investigated a series of potential problems and solutions in the industrialization of embedded passive components.